Shenzhen Depu Microelectronics Co., Ltd. was established in April 2006 with a registered capital of 10 million. It is located in High-tech Park, Nanshan District, Shenzhen. It is mainly engaged in integrated circuit design, packaging testing and sales.
The company has the ability to achieve an annual output value of 500 million yuan and ship 3 billion integrated circuits annually. The company adopts the mode of outsourcing Fujitsu packaging and testing processing and self-built production base, and the production base purchases the industry's top production and testing equipment, such as: ASM AD838 die bonding machine, K&S bonding machine, Langcheng mold and cutting rib forming system, and other advanced equipment. The company is actively committed to the sustainable development of the national microelectronics industry, using professional experience in the field of high-tech, to provide excellent quality products and system solutions for the construction of a harmonious and efficient society, to achieve the whole industry chain. win-win.